Processes
Direct laser writing, photomask fabrication
The KLOE Dilase 650 laser writer integrates two different lasers emitting one at 375nm and another at 405nm. The system can write in vector mode, scanning mode, and a combination of both modes of writing for the same pattern. The system is capable to reach an aspect ratio of 1x20 (ideally 1x25). It’s equipped with two optical tubes with beam sizes of 1µm and 10µm. The feature realizes the direct write for ultra-thick photoresist, especially for microfluidics. Dilase 650 allows writing patterns in photosensitive resists deposited on planar substrates up to 6 inches diameter and mask blank up to 7 inches.