ICP-RIE

Overview

Equipment Type
Inductively Coupled Plasma – Reactive Ion Etching

Manufacturer
Oxford

Model
PlasmaPro 100 Cobra

Processes
Gases: BCl3, Cl2, CHF3, CF4, SF6, O2, H2, Ar, N2

The Oxford PlasmaPro System 100 Cobra is a load-locked high plasma density system. The system is built on 200mm wafer platforms, with single-wafer and multi-wafer batch capability. It is equipped with variety of etching gases and can handle research samples including III-V materials, semiconductors, and select metals.

The system has a 300W 13.56MHz RF generator for etching processes as well as a 3kW 2MHz RF generator connected to a 300mm diameter ICP source. The electrical heating kit allows the system to reach a maximum temperature of 60°C.

The system is equipped with an Atomic Layer Etching (ALE) dose kit which allows atomic layer etching.